Miyatsu Co., Ltd.

Semiconductor manufacturing
equipment related

With a fully equipped clean room (class 5000 compatible), we engage in many manufacturing related to semiconductor front-end manufacturing equipment.

  • Single-wafer Ashing Equipment
  • Single-wafer Plasma Nitriding / Oxidizing Equipment
  • Single-Wafer Annealing Equipment
  • Batch Production Film Deposition Equipment
  • Plasma Vacuum Equipment
  • Plasma CVD Equipment
  • Plasma Etching Equipment
  • OLED Display Manufacturing Equipment

Infrastructure related

  • Dam system operation monitoring device
  • Dam water position, discharge monitoring system
  • Bullet train equipment board
  • Schurter switchboard
  • Simulator for broadcasting stations
  • Digital broadcasting equipment

Vehicle-mounted test equipment related

  • System Control Unit
  • System Operation Unit
  • Converting device

Batch ashing device

The device that removes photoresist, which is used as a mask to create circuits on wafers in the semiconductor wafer process.
You can choose according to your application.
Wafer sizes are compatible with 150 mm and 200 mm.

MG6500R

MG8500R

Product features
  • Saving footprint
  • Cost improvement is possible by making compact control rack
  • Improvement of communication system such as strengthening noise countermeasures and wiring saving using Ethernet
  • Optimization of direct-acting single-arm type transfer robot by new original design of transfer system
  • Avoiding PC model change convergence problem and HDD failure by adopting PLC control
  • High throughput
  • Realization of low damage batch plasma ashing system
Product details

MG6500R

Processing wafer size 150mm (6 inches), optional 5 inches
Processing method Axial barrel method
RF power supply 1kW 13.56MHz auto tuning
Process gas O2
Purge gas N2
Processing step 3 steps (128 recipes)
Processing room Cylindrical / vertical quartz chamber
Wafer transfer unit Vertical operating cassette elevator
Vertical operating clean robot (single arm 2-finger-suction type)
Throughput > 50 sheets / hour or more
Utility Power supply: φ3 200V
Vacuum pump: 10.000L / min
O2: 0.2MPa | N2: 0.3MPa | CDA: 0.5MPa
Finger suction: -80 to -60KPa
Body dimensions (mm) 600W × 1300D × 1780H
Control rack dimensions (mm) 550W X 650D X 745H
Weight (kg) 300(Body dimensions), 120(Control rack)

MG8500R

Processing wafer size 200mm(8 inches)
Processing method Axial barrel method
RF power supply 2kW 13.56MHz auto tuning
Process gas O2
Purge gas N2
Processing step 3 steps (128 recipes)
Processing room Cylindrical / vertical quartz chamber
Wafer transfer unit Vertical operating cassette elevator Vertical operating clean robot (single arm 2-finger-suction type)
Throughput > 50 sheets / hour or more
Utility Power supply: φ3 200V
Vacuum pump: 10.000L / min
O2: 0.2MPa | N2: 0.3MPa | CDA: 0.5MPa
Finger suction: -80 to -60KPa
Body dimensions (mm) 850W x 1200D x 1950H (excluding protrusions, ducts, and connecting pipes)
Control rack dimensions (mm) 550W x 650D x 835H (excluding protrusions)
Weight (kg) 500 (main body), 120 (control rack)

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