Products
Semiconductor manufacturing
equipment related
With a fully equipped clean room (class 5000 compatible), we engage in many manufacturing related to semiconductor front-end manufacturing equipment.
- Single-wafer Ashing Equipment
- Single-wafer Plasma Nitriding / Oxidizing Equipment
- Single-Wafer Annealing Equipment
- Batch Production Film Deposition Equipment
- Plasma Vacuum Equipment
- Plasma CVD Equipment
- Plasma Etching Equipment
- OLED Display Manufacturing Equipment
Infrastructure related
- Dam system operation monitoring device
- Dam water position, discharge monitoring system
- Bullet train equipment board
- Schurter switchboard
- Simulator for broadcasting stations
- Digital broadcasting equipment
Vehicle-mounted test equipment related
- System Control Unit
- System Operation Unit
- Converting device
Batch ashing device
The device that removes photoresist, which is used as a mask to create circuits on wafers in the semiconductor wafer process.
You can choose according to your application.
Wafer sizes are compatible with 150 mm and 200 mm.
MG6500R
MG8500R
Product features
- Saving footprint
- Cost improvement is possible by making compact control rack
- Improvement of communication system such as strengthening noise countermeasures and wiring saving using Ethernet
- Optimization of direct-acting single-arm type transfer robot by new original design of transfer system
- Avoiding PC model change convergence problem and HDD failure by adopting PLC control
- High throughput
- Realization of low damage batch plasma ashing system
Product details
MG6500R
| Processing wafer size | 150mm (6 inches), optional 5 inches |
|---|---|
| Processing method | Axial barrel method |
| RF power supply | 1kW 13.56MHz auto tuning |
| Process gas | O2 |
| Purge gas | N2 |
| Processing step | 3 steps (128 recipes) |
| Processing room | Cylindrical / vertical quartz chamber |
| Wafer transfer unit | Vertical operating cassette elevator Vertical operating clean robot (single arm 2-finger-suction type) |
| Throughput | > 50 sheets / hour or more |
| Utility |
Power supply: φ3 200V Vacuum pump: 10.000L / min O2: 0.2MPa | N2: 0.3MPa | CDA: 0.5MPa Finger suction: -80 to -60KPa |
| Body dimensions (mm) | 600W × 1300D × 1780H |
| Control rack dimensions (mm) | 550W X 650D X 745H |
| Weight (kg) | 300(Body dimensions), 120(Control rack) |
MG8500R
| Processing wafer size | 200mm(8 inches) |
|---|---|
| Processing method | Axial barrel method |
| RF power supply | 2kW 13.56MHz auto tuning |
| Process gas | O2 |
| Purge gas | N2 |
| Processing step | 3 steps (128 recipes) |
| Processing room | Cylindrical / vertical quartz chamber |
| Wafer transfer unit | Vertical operating cassette elevator Vertical operating clean robot (single arm 2-finger-suction type) |
| Throughput | > 50 sheets / hour or more |
| Utility |
Power supply: φ3 200V Vacuum pump: 10.000L / min O2: 0.2MPa | N2: 0.3MPa | CDA: 0.5MPa Finger suction: -80 to -60KPa |
| Body dimensions (mm) | 850W x 1200D x 1950H (excluding protrusions, ducts, and connecting pipes) |
| Control rack dimensions (mm) | 550W x 650D x 835H (excluding protrusions) |
| Weight (kg) | 500 (main body), 120 (control rack) |
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