Products
Semiconductor manufacturing
equipment related
With a fully equipped clean room (class 5000 compatible), we engage in many manufacturing related to semiconductor front-end manufacturing equipment.
- Single-wafer Ashing Equipment
- Single-wafer Plasma Nitriding / Oxidizing Equipment
- Single-Wafer Annealing Equipment
- Batch Production Film Deposition Equipment
- Plasma Vacuum Equipment
- Plasma CVD Equipment
- Plasma Etching Equipment
- OLED Display Manufacturing Equipment
Infrastructure related
- Dam system operation monitoring device
- Dam water position, discharge monitoring system
- Bullet train equipment board
- Schurter switchboard
- Simulator for broadcasting stations
- Digital broadcasting equipment
Vehicle-mounted test equipment related
- System Control Unit
- System Operation Unit
- Converting device
Batch ashing device
The device that removes photoresist, which is used as a mask to create circuits on wafers in the
semiconductor wafer process.
You can choose according to your application.
Wafer sizes are compatible with 150 mm and 200 mm.
-
MG6500R
-
MG8500R
-
MG200
Product features
- Saving footprint
- Cost improvement is possible by making compact control rack
- Improvement of communication system such as strengthening noise countermeasures and wiring saving using Ethernet
- Optimization of direct-acting single-arm type transfer robot by new original design of transfer system
- Avoiding PC model change convergence problem and HDD failure by adopting PLC control
- High throughput
- Realization of low damage batch plasma ashing system
Product details
You can scroll horizontally
| MG6500R | MG8500R | MG200 | |
|---|---|---|---|
| Processing wafer size | 150mm(6inches)optional125mm(5inches) | 200mm(8inches) | |
| Processing method | Axial barrel method | Single wafer type | |
| RF power supply | 1kW 13.56MHz auto tuning | 2kW 13.56MHzauto tuning | 3kW 27.12MHz |
| Process gas | O2 | ||
| Purge gas | N2 | ||
| Processing step | 3 steps(128recipes) | 20steps(100recipes) | |
| Number of chambers | Cylindrical / vertical quartz chamberｘ1 | 2 | |
| Wafer transfer unit | Vertical operating cassette elevator Vertical operating clean RBT |
Cassette loader (SMIForOPEN) Atmospheric transport /Vacuum transport RBT |
|
| Throughput | > 50 sheets / hour or more | > 100 sheets / hour or more | |
| Our standard positive resist for evaluation | |||
| t=1.0um | t<2.4um< /td> | ||
| Utility |
Power supply: φ3 200V Vacuum pump: 10kL / min O2: 0.2MPa | N2: 0.3MPa | CDA: 0.5MPa Finger suction: -80 to -60KPa |
Power supply: φ3 200V Vacuum pump: 10kL / min O2: 0.2MPa | N2: 0.3MPa | CDA: 0.5MPa Finger suction: -80 to -60KPa |
Power supply: φ3 200V Vacuum pump: 5kL / min x2(Process chamber) Vacuum pump: 1.4kL / min x1(Load lock chambe) O2: 0.1MPa | N2: 0.1MPa | CDA: 0.5MPa Cooling water:>13L/min <0.5MPa |
| MainBody (mm) | 600Wx1300Dx780H | 850Wx1200Dx1950H | 980Wx2058Dx1910H |
| Control rack(mm) | 550Wx650Dx745H | 550Wx650Dx835H | 503Wx432Dx1448H |
| weight(kg) | 300(MainBody)、120(Control rack) | 500(MainBody)、120(Control rack) | 1300(MainBody)、100(Control rack) |
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